• Pad-Per-Hole. Copper plated-thru holes both sides.
• 0.080” diameter isolated solder pad around each holes on both sides.
• Unrestricted component placement and extended area for high density applications.
• Board can be cut down into smaller units.
Downloads
Specifications
Dimensions (H x W x Thick) | 5.00" x 13.25" x 0.062" (127mm x 336.55mm x 1.57mm) |
Hole Diameter | 0.042" (1.067mm) Plated Thru |
Grid | 0.100" x 0.100" (2.54mm x 2.54mm) |
Circuit Pattern | Pad per hole both sides |
Material | FR4 |
UL Flammability Class | 94V-0 |
16 Pin DIP Capacity | 60 |
Wire-Wrap Terminals | T44, T46, T49, T68 |
Solder Terminals | T42-1, K24C, K31C |
Wire-Wrap Socket Pins | R32 |
Description
Ordering Info
Part Number : 8006