Pad-Per-Hole pattern
on component side.
Overall
Ground Plane pattern
on wiring side and
holes not plated through.
0.080” dia. isolated
solder pad around
holes on component
side
Accommodates
any type DIP IC
device or discrete
Plane
surfaces solder-coated
for user conveniencey
To commit wire-wrap
pins to voltage
and ground planes,
use Vector: T124
solder washers
Vector: T124 solder
washers available
separately