10.6" x 18.0", Hole Dia.:
0.042", Grid: 0.100" x 0.100"
Pad-Per-Hole,
Plated-thru holes
Isolated round pads
around each hole
0.080” diameter, isolated
solder pad around
each hole on both
sides
Unrestricted
component
placement
&
extended
area
for
high
density
applications