Specifications

• 3-hole solder pad for interconnecting multiple component leads.

​• I/O area with square solder pads for connectors mounting.

• Circuit pattern etched onto one side only.

• Single sided with no etch and plating on reverse side.

• ​Solder mount DIP sockets or IC devices with any lead spacing.

8001   Vectorbord® Circbord™

Ordering Info


        Part Number : 8001

Downloads

Description

Dimensions

(H x W x Thick)

4.50" x 6.50" x 0.062"

(114.3mm x 165.1mm x 1.57mm)

Hole Diameter

0.042" (1.067mm) Not Plated Thru

Grid

0.100" x 0.100" 

(2.54mm x 2.54mm)

Circuit Pattern

3-Hole pad one side only

Material
CEM-1
UL Flammability Class 94V-0
16 Pin DIP Capacity
20
Wire-Wrap Terminals
T44, T46, T49, T68
Solder TerminalsT42-1, K24C, K31C
Wire-Wrap Socket Pins
R32