Description

• 3-hole solder pad for interconnecting multiple component leads.

• I/O area with square solder pads for connectors mounting.

• Circuit pattern etched onto both sides.

• Double sided with plated thru holes.

• ​Solder mount DIP sockets or IC devices with any lead spacing.

8023   Vectorbord® Circbord™

Downloads

Specifications

Ordering Info

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        Part Number : 8023

Dimensions

(H x W x Thick)

4.50" x 6.50" x 0.062"

(114.3mm x 165.1mm x 1.57mm)

Hole Diameter

0.042" (1.067mm) Plated Thru

Grid

0.100" x 0.100" 

(2.54mm x 2.54mm)

Circuit Pattern

3-Hole pad - both sides

Material
FR-4
UL Flammability Class 94V-0
16 Pin DIP Capacity
20
Wire-Wrap Terminals
T44, T46, T49, T68
Solder TerminalsT42-1, K24C, K31C
Wire-Wrap Socket Pins
R32